What chip industry engineers were watching this year.

Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

NVIDIA's whopper deal; Samsung's ChipAgents investment; power IC buildout in India; automotive deals; DRAM IP secrets leaked; ...

Designers are utilizing an array of programmable or configurable ICs to keep pace with rapidly changing technology and AI.

A new technical paper titled “Advantage in distributed quantum computing with slow interconnects” was published by ...

A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, ...

Researchers from the University of Southern California Information Sciences Institute and the University of Wisconsin-Madison ...

A new technical paper titled “A Tensor Compiler for Processing-In-Memory Architectures” was published by researchers at ...

Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

Ensuring that verification platforms can scale with industry demands and support new use cases as they emerge.